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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
11 Years
| Ask Lasest Price | |
| Brand Name : | XCE |
| Model Number : | XCER |
| Certification : | CE,FCC,Rohs,ISO9001,SGS,UL |
| Price : | USD 1-500 |
| Payment Terms : | Western Union, L/C, T/T |
| Supply Ability : | 10000000pcs / per month |
3D Printer Multi-Layer Rigid PCB Circuit Boards With Specialty Metal Core
Quick detail:
| Place of Origin:Guangdong, China (Mainland) |
| Brand Name: XCE |
| Model Number: XCER |
| Number of Layers: 6-Layer |
| Base Material: FR-4 |
| Copper Thickness: inner layers 1oz, outer layers 1.5oz |
| Board Thickness: 62mil |
| Surface Finishing: immersion gold |
Parameter:
| Layer No. | 1-26 | ||||||||
| Min board thickness | 2 layer 0.2mm | ||||||||
| 4 layer 0.4mm | |||||||||
| 6 layer 0.6mm | |||||||||
| 8 layer 0.8mm | |||||||||
| 10 layer 1.0mm | |||||||||
| Max panel size | 508*610mm | ||||||||
| Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% | ||||||||
| Wall hole copper thickness | ＞0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
PCB Capabilities By Market: | |
1. | High Reliability PC Boards |
-Up to 2000 Thermal cycles | |
2. | Burn-in Boards |
-6 Layers - .042" thick | |
-.5 mm pitch | |
-Step-down connectors | |
-Special materials | |
-Large sizes up to 24" x 28" | |
-High Reliability | |
3. | High Technology Boards |
-Microelectronics (Line and Space down to .00125"/.00125") | |
-Differential Impedance | |
-Up to 30 Layers | |
-Lead Free process | |
-Special materials | |
-Sequential lamination | |
-Blind and buried vias | |
-Laser Drill | |
-Filled vias | |
-Via in pads | |
-Milspec | |
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