| Sign In | Join Free | My burrillandco.com |
|
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
10 Years
| Ask Lasest Price | |
| Brand Name : | XCE |
| Model Number : | XCEM |
| Certification : | CE,ROHS, FCC,ISO9008,SGS,UL |
| Price : | negotiation |
| Payment Terms : | T/T,Western union |
| Supply Ability : | 1, 000, 000 PCS / week |
| Delivery Time : | 5-10 days |
Digital Radio Antennas High Frequency Pcb , OEM High Precision Rohs Printed Circuit Boards
Specification:
High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
High frequency materials are UL 94V-0 rated for active devices and high power RF designs.
Advantage
OEM High Precision Digital Radio Antennas High Frequency PCB
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical
Inspection),QA/QC,fly porbe ,Etesting
Parameter:
| PRODUCT’S DETAILS | |
| Raw Material | HIgh Frequency Material |
| Layer Count | 2-Layer |
| Board Thickness | 1.6mm |
| Copper Thickness | 35UM |
| Surface Finish | Immerison Silver |
| Solder Mask | / |
| Silkscreen | / |
| Min. Trace Width/Spacing | 0.075/0.075mm |
| Min. Hole Size | 0.25mm |
| Hole Wall Copper Thickness | ≥20μm |
| Measurement | 60*159mm |
| Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
| Application | Communication,automobile,cell,computer,medical |
| Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
| Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
We can offer production with high quality and competitive:
| Item | Mass Production | Pilot Run Production |
| Capacity | Capacity | |
| Layer Counts | 1L_18L, HDI | 20-28 , HDI |
| Material | FR4 | |
| Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880) Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. | ||
| Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
| FR4+Ro4350 , Rogers3003+FR4 | ||
| Maximum Size | 610mm X 1200mm | 1200 - 2000MM |
| Board Outline Tolerance | ±0.15mm | ±0.10mm |
| Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
| Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
| Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
| Minimum Line / Space | 0.10mm | 0.075mm |
| Trace width Tolerance | 15%-20% | 10% |
| Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
| Minimum laser hole | 0.1mm | 0.075mm |
| Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm | |
| Mini hole ring (single | 0.075MM | 0.05MM |
| OutLayer Copper Thickness | 17um--175um | 175um--210um |
| InnerLayer Copper Thickness | 17um--175um | 175um--210um |
| Mini Solder Mask Bridge | 0.05mm | 0.025mm |
| Impedance Control Tolerance | ±10% | ±5% |
| Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. | |
| Plated gold , OSP, Carbon ink, | ||
| 1-2L Lead-time | 3-7 days | 1-2 days |
| 4- 8L Lead-time | 7-10 days | 2-7 days |
| 10-18L Lead-time | 10-15 days | 4-9 days |
| 20-28L Lead-time | 15-20 days | |
| Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. | |
| Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> | |
Parameter
| XCE PCB technical specifications | |
| Material | High Frequency Material |
| Layer No. | 2 |
| Min board thickness | 2 layer0.2mm 4 layer0.4mm 6 layer 0.6mm 8 layer 0.8mm 10 layer 1.0mm |
| Max panel size | 508*610mm |
| Board thickness tolerance | T≥0.8mm±8%.,T<0.8mm±5% |
| Wall hole copper thickness | >0.025mm(1mil) |
| Finished hole | 0.2mm-6.3mm |
| Min line width | 4mil/4mil(0.1/0.1mm) |
| Min bonding pad space | 0.1mm(4mil) |
| PTH aperture tolerance | ±0.075mm(3mil) |
| NPTH aperture tolerance | ±0.05mm(2mil) |
| Hole site deviation | ±0.05mm(2mil) |
| Profile tolerance | ±0.10mm(4mil) |
| Board bend&warp | ≤0.7% |
| Insulation resistance | >1012Ωnormal |
| Through-hole resistance | <300Ωnormal |
| Electric strength | >1.3kv/mm |
| Current breakdown | 10A |
| Peel strength | 1.4N/mm |
| Soldmask regidity | >6H |
| Thermal stress | 288℃20Sec |
| Testing voltage | 50-300V |
| Min buried blind via | 0.2mm(8mil) |
| Outer copper thickness | 1oz-5oz |
| Inner cooper thickness | 1/2 oz-4oz |
| Aspect ratio | 8:1 |
| SMT min green oil width | 0.08mm |
| Min green oil open window | 0.05mm |
| Insulation layer thickless | 0.075mm-5mm |
| Taphole aperture | 0.2mm-0.6mm |
| Special technology | Indepedance,Blind buried via,thick gold,aluminum PCB |
| Surface finish | HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating |
|
|
