Sign In | Join Free | My burrillandco.com
burrillandco.com

Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

Site Member

10 Years

Home > RF PCB >

RFID Sensor Remote Control SHF Rogers RF PCB Board For Gps Tracking In Radar Systerm ER 2.2

Shenzhen Xinchenger Electronic Co.,Ltd
Contact Now
    Buy cheap RFID Sensor Remote Control SHF Rogers RF PCB Board For Gps Tracking In Radar Systerm ER 2.2 from wholesalers
     
    Buy cheap RFID Sensor Remote Control SHF Rogers RF PCB Board For Gps Tracking In Radar Systerm ER 2.2 from wholesalers
    • Buy cheap RFID Sensor Remote Control SHF Rogers RF PCB Board For Gps Tracking In Radar Systerm ER 2.2 from wholesalers
    • Buy cheap RFID Sensor Remote Control SHF Rogers RF PCB Board For Gps Tracking In Radar Systerm ER 2.2 from wholesalers

    RFID Sensor Remote Control SHF Rogers RF PCB Board For Gps Tracking In Radar Systerm ER 2.2

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCE RT
    Certification : CE,ROHS,FCC,ISO9008,SGS,UL
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Supply Ability : 1000000 pieces per week
    Delivery Time : 5-10 working days
    • Product Details
    • Company Profile

    RFID Sensor Remote Control SHF Rogers RF PCB Board For Gps Tracking In Radar Systerm ER 2.2

    RFID Sensor Remote Control SHF Rogers Pcb Board For Gps Tracking In Radar Systerm ER 2.2

    Products Details

    Raw MaterialRogers
    Layer CountMultilayer
    Board Thickness0.8mm
    Copper Thickness2 oz
    Surface FinishImmersion Gold Over Nickle
    Solder MaskGreen
    SilkscreenWhite
    Min. Trace Width/Spacing0.075/0.075mm
    Min. Hole Size0.25mm
    Hole Wall Copper Thickness≥20μm
    Measurement120*120mm
    PackagingInner: Vacuum-packed in soft plastic bales
    Outer: Cardboard Cartons with double straps
    ApplicationCommunication,automobile,cell,computer,medical
    AdvantageCompetitive Price,Fast Delivery,OEM&ODM,Free Samples,
    Special RequirementsBuried And Blind Via, Impedance Control, Via Plug,
    BGA Soldering And Gold Finger Are Acceptable
    CertificationUL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

    PCB Capability


    Layer1-30L
    MaterialCEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate ,Rogers ,Neclo, Taconic and Isola pcb .
    Board Thinckness0.2-6mm
    Max Finish Size800*508mm
    Min. Drill Hole Size0.25mm
    Min. Line Width0.075mm(3mil)
    Min. Line Spacing0.075mm(3mil)
    Surface finishHAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
    Copper thickness0.5-4.0 Oz
    Solder mask colorgreen/black/white/red/blue/yellow
    Inner packingVacuum packing, Plastic Bag
    Outer packingstandard carton packing
    Hole tolerancePTH:±0.076,NTPH:±0.05
    CertificateISO9001,SGS
    Profiling punchingRouting,V-CUT,Beveling

    PrePreg Material

    ParameterValue
    Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
    Water absorption−0.125 in < 0.10%
    Temperature index140 °C (284 °F)
    Thermal conductivity, through-plane0.29 W/(m·K), 0.343 W/(m·K)
    Thermal conductivity, in-plane0.81 W/(m·K), 1.059 W/(m·K)
    Rockwell hardness110 M scale
    Bond strength> 1,000 kg (2,200 lb)
    Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
    Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
    Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
    Izod impact strength - LW> 54 J/m (10 ft·lb/in)
    Izod impact strength - CW> 44 J/m (8 ft·lb/in)
    Compressive strength - flatwise> 415 MPa (60,200 psi)
    Dielectric breakdown (A)> 50 kV
    Dielectric breakdown (D48/50)> 50 kV
    Dielectric strength20 MV/m
    Relative permittivity (A)4.8
    Relative permittivity (D24/23)4.8
    Dissipation factor (A)0.017
    Dissipation factor (D24/23)0.018
    Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
    Glass transition temperatureCan vary, but is over 120 °C
    Young's modulus - LW3.5×106 psi (24 GPa)
    Young's modulus - CW3.0×106 psi (21 GPa)
    Coefficient of thermal expansion - x-axis1.4×10−5 K−1
    Coefficient of thermal expansion - y-axis1.2×10−5 K−1
    Coefficient of thermal expansion - z-axis7.0×10−5 K−1
    Poisson's ratio - LW0.136
    Poisson's ratio - CW0.118
    LW sound speed3602 m/s
    SW sound speed3369 m/s
    LW Acoustic impedance6.64 MRayl


    Compared Data :

    ModelERTanδ@ 1GHzCter (ppm/℃)

    CTE (X,Y)

    (ppm/℃)

    FR4Normal4.60.03017
    FR4PCL370(FR4-HTG)4.30.00155117
    FR4117 (FR4-HTG)4.40.01317
    Park NecloN4000-6-FC BC (FR4-HTG)4.10.001516




    Competitive Advantage:
    1) With UL,ROHS,ISO,IPC
    2).Lead time:3-10 working days
    3)Competitive price best quality
    4).Rich 20 years experience in High Tg Multilayer PCB .


    What Information customer need to provide for quotation ?
    1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
    2. BOM list for PCB assembly.
    3. Send us your sample PCB or PCBA.
    4. OEM is acceptable.


    Detail :



    Quality RFID Sensor Remote Control SHF Rogers RF PCB Board For Gps Tracking In Radar Systerm ER 2.2 for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Shenzhen Xinchenger Electronic Co.,Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)