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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
10 Years
| Ask Lasest Price | |
| Brand Name : | XCE |
| Model Number : | XCE GR |
| Certification : | CE,ROHS,FCC,ISO9008,SGS,UL |
| Price : | Negotiation |
| Payment Terms : | T/T, Western Union |
| Supply Ability : | 1000000 pieces per week |
| Delivery Time : | 5-10 working days |
High Frequency RF Hybrids Fr4 Pcb Board 1.6 MM Used In Wireless Telecomunication Transceiver
Products Details
We are the highest efficience pcb manufature here .
(1) Professional Manufacturer on PCB for about 10 years
(2) More than 500 workers, over 4,000 square meters for day-output and 1,000,000 square meters for year-output.
(3) Plant passed passed ISO/TS16949: 2000 and ISO14001: 2004
and products meet IPC-A-600F, IPC-D-600G, MIL-STD-105D LEVEL II, UL
and SGS Certification
| Feature | Parameter (in) |
| Surface processing | Lead- Free HASL/Plating gold / immersion gold /Plating gold finger/OSP |
| Layers | 1~24 layers |
| Copper Thickness | O.5OZ~10OZ |
| Board Thickness Range | 14~276mil |
| Min Hole Size | 3mil |
| Impedance Control | ±5% |
| Flammability | 94V-0 |
| Warp & Twist | ≦0.7% |
| Thermal Shock | 5×10Sec@288 |
| Aspect Radio | 18:1 |
| Min Line Width/Space | 2mil /2mil |
| PTH Dia. Tolerance | ±2mil |
| NPTH Dia. Tolerance | ±1mil |
| Hole Position Deviation | ±3mil |
| Outline Tolerance | ±4mil |
| S/M Pitch | 3mil |
| HDI Capability | Any layer |
OME Manufature
a. We manufacture PCB,PCBA,Singe/Double side PCB, Multilayer PCB,Aluminium PCB,Spray Tin PCB,Immersed Gold PCB,HDI Mobilephone PCB,Gold-plating PCB,(printed circuit board with assembly) PCBA,SMT PCBA,DIP PCBA,PCB&PCBA Copy,PCB Assembly,OSP,HASL,etc.
b. Expert circuit board testing, high quality factory wholesale price
c. PCB OEM&ODM Clone/Copy, conform to UL,SGS,RoHS
We offer our customers a wide range material and boards:
1. Single-sided, double-side, multi-layer PCB & Aluminium LED PCB
2. HASL, HAL lead free, OSP, Immersion Gold/ Silver/ Tin surface finish available
3. Base Materials: FR4, High TG FR4,CEM-1, CEM3, Aluminum(metal core)
4. Aluminum PCB board thickness from 0.8mm-3.6mm
5. Quantity from prototype to volume production
6. Fast turnaround time, prompt delivery, high quality at competitive price Detailed Specification of PCB Manufacturing
| Raw Material | Fr4 |
| Layer Count | Multilayer |
| Board Thickness | 1.6 mm |
| Copper Thickness | 2 oz |
| Surface Finish | Immersion Gold Over Nickle |
| Solder Mask | Green |
| Silkscreen | White |
| Min. Trace Width/Spacing | 0.075/0.075mm |
| Min. Hole Size | 0.25mm |
| Hole Wall Copper Thickness | ≥20μm |
| Measurement | 210*50 mm |
| Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
| Application | Communication,automobile,cell,computer,medical |
| Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
| Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
PrePreg Material
| Parameter | Value |
| Specific gravity/density | 1.850 g/cm3 (3,118 lb/cu yd) |
| Water absorption | −0.125 in < 0.10% |
| Temperature index | 140 °C (284 °F) |
| Thermal conductivity, through-plane | 0.29 W/(m·K), 0.343 W/(m·K) |
| Thermal conductivity, in-plane | 0.81 W/(m·K), 1.059 W/(m·K) |
| Rockwell hardness | 110 M scale |
| Bond strength | > 1,000 kg (2,200 lb) |
| Flexural strength (A; 0.125 in) - LW | > 440 MPa (64,000 psi) |
| Flexural strength (A; 0.125 in) - CW | > 345 MPa (50,000 psi) |
| Tensile strength (0.125 in) LW | > 310 MPa (45,000 psi) |
| Izod impact strength - LW | > 54 J/m (10 ft·lb/in) |
| Izod impact strength - CW | > 44 J/m (8 ft·lb/in) |
| Compressive strength - flatwise | > 415 MPa (60,200 psi) |
| Dielectric breakdown (A) | > 50 kV |
| Dielectric breakdown (D48/50) | > 50 kV |
| Dielectric strength | 20 MV/m |
| Relative permittivity (A) | 4.8 |
| Relative permittivity (D24/23) | 4.8 |
| Dissipation factor (A) | 0.017 |
| Dissipation factor (D24/23) | 0.018 |
| Dielectric constant permittivity | 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz |
| Glass transition temperature | Can vary, but is over 120 °C |
| Young's modulus - LW | 3.5×106 psi (24 GPa) |
| Young's modulus - CW | 3.0×106 psi (21 GPa) |
| Coefficient of thermal expansion - x-axis | 1.4×10−5 K−1 |
| Coefficient of thermal expansion - y-axis | 1.2×10−5 K−1 |
| Coefficient of thermal expansion - z-axis | 7.0×10−5 K−1 |
| Poisson's ratio - LW | 0.136 |
| Poisson's ratio - CW | 0.118 |
| LW sound speed | 3602 m/s |
| SW sound speed | 3369 m/s |
| LW Acoustic impedance | 6.64 MRayl |
Compared Data :
| Model | ER | Tanδ@ 1GHz | Cter (ppm/℃) | CTE (X,Y) (ppm/℃) | |
| FR4 | Normal | 4.6 | 0.030 | 17 | |
| FR4 | PCL370(FR4-HTG) | 4.3 | 0.0015 | 51 | 17 |
| FR4 | 117 (FR4-HTG) | 4.4 | 0.013 | 17 | |
| Park Neclo | N4000-6-FC BC (FR4-HTG) | 4.1 | 0.0015 | 16 |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
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