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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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ROHS PCB Circuit Board Fabrication With Immersion Gold Surface

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap ROHS PCB Circuit Board Fabrication With Immersion Gold Surface from wholesalers
     
    Buy cheap ROHS PCB Circuit Board Fabrication With Immersion Gold Surface from wholesalers
    • Buy cheap ROHS PCB Circuit Board Fabrication With Immersion Gold Surface from wholesalers
    • Buy cheap ROHS PCB Circuit Board Fabrication With Immersion Gold Surface from wholesalers

    ROHS PCB Circuit Board Fabrication With Immersion Gold Surface

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCES
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    ROHS PCB Circuit Board Fabrication With Immersion Gold Surface

    Single Sided PCB Circuit Board Fabrication With Immersion Gold Surface


    Quick detail:

    Origin:ChinaLine space:5mil
    Layer:2Thickness:0.2mm
    Surface: ENIGHole:0.8

    Parameter:

    XCE PCB technical specifications
    Annual stock MaterialRogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free
    Layer No.1~16 multilayer pcb
    Min board thickness

    2 layer0.2mm

    4 layer0.4mm

    6 layer 0.6mm

    8 layer 0.8mm

    10 layer 1.0mm

    Max panel size508*610mm
    Board thickness toleranceT0.8mm±8%.,T<0.8mm±5%
    Wall hole copper thickness>0.025mm(1mil)
    Finished hole0.2mm-6.3mm
    Min line width4mil/4mil(0.1/0.1mm)
    Min bonding pad space0.1mm(4mil)
    PTH aperture tolerance±0.075mm(3mil)
    NPTH aperture tolerance±0.05mm(2mil)
    Hole site deviation±0.05mm(2mil)
    Profile tolerance±0.10mm(4mil)
    Board bend&warp0.7%
    Insulation resistance>1012Ωnormal
    Through-hole resistance<300Ωnormal
    Electric strength>1.3kv/mm
    Current breakdown10A
    Peel strength1.4N/mm
    Soldmask regidity>6H
    Thermal stress28820Sec
    Testing voltage50-300V
    Min buried blind via0.2mm(8mil)
    Outer copper thickness1oz-5oz
    Inner cooper thickness1/2 oz-4oz
    Aspect ratio8:1
    SMT min green oil width0.08mm
    Min green oil open window0.05mm
    Insulation layer thickless0.075mm-5mm
    Taphole aperture0.2mm-0.6mm
    Special technologyIndepedance,Blind buried via,thick gold,aluminum PCB
    Surface finishHASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

    Files:Gerber,protel,powerpcb,Autocad,etc.

    Material:FR-1,FR-4,CEM-1,CEM-3,HI-TG,Aluminum

    Layer count:1-24 layers multilayer pcb

    Max.Panel Size:450*1500mm

    Board Thickness:0.2-5mm

    Min. Core Thickness:0.075mm

    Cu Thickness:12-140um

    Min. Drill Size:0.2mm

    Max. Aspect Ratio: 8:1

    Min. Trace Width: 0.1mm

    Min line spacing:0.075mm

    Min. SMT/QFP Pitch:0.4mm


    v Fast PCB Fabrication for Samples and Mass Production

    v Electronic Components Sourcing Services

    v PCBA Assembly Services:SMT,DIP,BGA...

    v Function Test

    v Stencil,Cable and Enclosure Assembly

    v Reverse engineering service

    v Standard Packing and On time Delivery


    Typical Applications

    • Cellular Base Station Antennas and Power Amplifiers
    • Microwave point to point (P2P) links
    • Automotive Radar and Sensors
    • RF Identification (RFID) Tags
    • LNB’s for Direct Broadcast Satellites

    Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

    High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.


    Features


    • High Thermal Performance
     Tg: 180°C (DSC)
     Td: 340°C (TGA @ 5% wt loss)
     Low CTE for reliability
    • T260: 60 minutes
    • T288: 30 minutes
    • RoHS Compliant
    • UV Blocking and AOI Fluorescence
     High throughput and accuracy during PCB
    fabrication and assembly
    • Superior Processing
     Closest to conventional FR-4 processing
    • Core Material Standard Availability
     Thickness: 0.002″ (0.05 mm) to 0.125″
    (3.2 mm)
     Available in full size sheet or panel form
    • Prepreg Standard Availability
     Roll or panel form
     Tooling of prepreg panels available
    • Copper Foil Type Availability
     Standard HTE Grade 3
     RTF (Reverse Treat Foil)
    • Copper Weights
     ½, 1 and 2 oz (18, 35 and 70 μm) available
     Heavier copper available upon request
     Thinner copper foil available upon request
    • Glass Fabric Availability
     Standard E-glass
     Square weave glass fabric available
     Spread glass fabric available
    • Industry Approvals
     IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
     UL - File Number E41625 as PCL-FR-370HR
     Qualified to UL's MCIL Program



    Quality ROHS PCB Circuit Board Fabrication With Immersion Gold Surface for sale
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