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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Isola Laminate Prepreg High TG PCB Circuit Board Design Prototype

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap Isola Laminate Prepreg High TG PCB Circuit Board Design Prototype from wholesalers
     
    Buy cheap Isola Laminate Prepreg High TG PCB Circuit Board Design Prototype from wholesalers
    • Buy cheap Isola Laminate Prepreg High TG PCB Circuit Board Design Prototype from wholesalers

    Isola Laminate Prepreg High TG PCB Circuit Board Design Prototype

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCEH
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
    • Company Profile

    Isola Laminate Prepreg High TG PCB Circuit Board Design Prototype

    Isola Laminate Prepreg High TG PCB Circuit Board Design Prototype


    Origin:ChinaSpecial: 2mil line width and space
    Layer:2Thickness:0.7mm
    Surface: ENIGHole:0.8

    Specification:


    370HR Laminate and Prepreg
    370HR is a high performance 180°C glass transition temperature
    (Tg) FR-4 system for multilayer Printed Wiring Board (PWB)
    applications where maximum thermal performance and reliability
    are required. 370HR laminate and prepreg products are
    manufactured with a unique high performance multifunctional
    epoxy resin, reinforced with electrical grade (E-glass) glass fabric.
    This system provides improved thermal performance and low
    expansion rates in comparison to traditional FR-4 while retaining
    FR-4 processability.
    In addition to this superior thermal performance, the mechanical,
    chemical and moisture resistance properties all equal or exceed
    the performance of traditional FR-4 materials. The 370HR system
    is also laser fluorescing and UV blocking for maximum compatibility
    with Automated Optical Inspection (AOI) systems, optical positioning
    systems and photoimagable solder mask imaging.
    370HR has proven to be best in class for sequential lamination



    • Polyimidemprodesu-highennalperfonnanwith
    Tg>2C (TMA)Td >405C%1 sTGAa)nd T300>60min.
    • Lω'erZs CTE of 1.20% ( 50-260C) offering superior PTH reliability.
    • Maini mechani 1 strength and bonding sngth at high temperature.
    • Tough resin systemNon-MOAemist
    • Haelfrree chemistry mpatible withe1 pro sslng.
    RoHSJWEEE mpliant.
    • IPC4101D.0/41


    Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

    High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.


    Parameter:


    oItemData
    1Layer:1 to 24 layers
    2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    3Board thickness:0.20mm to 3.4mm
    4Copper thickness:0.5 OZ to 4 OZ
    5Copper thickness in hole:>25.0 um (>1mil)
    6Max. Board Size:(580mm×1200mm)
    7Min. Drilled Hole Size:4mil(0.1mm)
    8Min. Line Width:3mil (0.075mm)
    9Min. Line Spacing:3mil (0.075mm)
    10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
    11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
    12Shape tolerance:±0.13
    13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
    14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
    15Certificate:UL,SGS,ISO 9001:2008
    16Special requirements:Buried and blind vias+controlled impedance +BGA
    17Profiling:Punching, Routing, V-CUT, Beveling

    Features


    • High Thermal Performance
     Tg: 180°C (DSC)
     Td: 340°C (TGA @ 5% wt loss)
     Low CTE for reliability
    • T260: 60 minutes
    • T288: 30 minutes
    • RoHS Compliant
    • UV Blocking and AOI Fluorescence
     High throughput and accuracy during PCB
    fabrication and assembly
    • Superior Processing
     Closest to conventional FR-4 processing
    • Core Material Standard Availability
     Thickness: 0.002″ (0.05 mm) to 0.125″
    (3.2 mm)
     Available in full size sheet or panel form
    • Prepreg Standard Availability
     Roll or panel form
     Tooling of prepreg panels available
    • Copper Foil Type Availability
     Standard HTE Grade 3
     RTF (Reverse Treat Foil)
    • Copper Weights
     ½, 1 and 2 oz (18, 35 and 70 μm) available
     Heavier copper available upon request
     Thinner copper foil available upon request
    • Glass Fabric Availability
     Standard E-glass
     Square weave glass fabric available
     Spread glass fabric available
    • Industry Approvals
     IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
     UL - File Number E41625 as PCL-FR-370HR
     Qualified to UL's MCIL Program


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