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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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2oz Black Sloder Immersion Gold High TG PCB Board Electronic Prototype

Shenzhen Xinchenger Electronic Co.,Ltd
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    Buy cheap 2oz Black Sloder Immersion Gold High TG PCB Board Electronic Prototype from wholesalers
     
    Buy cheap 2oz Black Sloder Immersion Gold High TG PCB Board Electronic Prototype from wholesalers
    • Buy cheap 2oz Black Sloder Immersion Gold High TG PCB Board Electronic Prototype from wholesalers
    • Buy cheap 2oz Black Sloder Immersion Gold High TG PCB Board Electronic Prototype from wholesalers

    2oz Black Sloder Immersion Gold High TG PCB Board Electronic Prototype

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCEM
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
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    2oz Black Sloder Immersion Gold High TG PCB Board Electronic Prototype


    2oz Black Sloder Immersion Gold PCB Board Electronic Prototype High TG Material


    Quick detail:

    Origin:ChinaSpecial: FR4 Material
    Layer:2Thickness:1.6mm
    Surface: HASL-LFHole:0.8

    Specification:

    FR-4 material is a fire code rating, represents a material specification is meant a resin material through the combustion state must be self-extinguishing, it is not a material name, but a material grade. So now FR-4 grade material is typically used in circuit boards, there are many species, but most are based on the so-called four-function (Tera-Function) plus epoxy filler (Filler) and glass fiber made composite materials.


    Typical Applications

    • Cellular Base Station Antennas and Power Amplifiers
    • Microwave point to point (P2P) links
    • Automotive Radar and Sensors
    • low dielectric loss
    • Ballast, lights, navigation
    • The stability of the dielectric constant
    • An extremely low water imbibition
    • IT industry,Keyboard products

    General FR-4 differs from high Tg FR-4: in the hot state, especially in the heat after moisture absorption, the mechanical strength of the material, dimensional stability, adhesion, water absorption, thermal decomposition, differences in thermal expansion and other various conditions, high Tg products significantly better than conventional PCB substrate material.


    Tg of the substrate is increased, PCB thermal resistance, moisture resistance, chemical resistance, stability and other characteristics will improve and improve. TG higher the value, the better the sheet temperature resistance, especially in the lead-free process, the high Tg applications more.


    Parameter:


    oItemData
    1Layer:1 to 24 layers
    2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    3Board thickness:0.20mm to 3.4mm
    4Copper thickness:0.5 OZ to 4 OZ
    5Copper thickness in hole:>25.0 um (>1mil)
    6Max. Board Size:(580mm×1200mm)
    7Min. Drilled Hole Size:4mil(0.1mm)
    8Min. Line Width:3mil (0.075mm)
    9Min. Line Spacing:3mil (0.075mm)
    10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
    11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
    12Shape tolerance:±0.13
    13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
    14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
    15Certificate:UL,SGS,ISO 9001:2008
    16Special requirements:Buried and blind vias+controlled impedance +BGA
    17Profiling:Punching, Routing, V-CUT, Beveling

    Features


    • High Thermal Performance
     Tg: 180°C (DSC)
     Td: 340°C (TGA @ 5% wt loss)
     Low CTE for reliability
    • T260: 60 minutes
    • T288: 30 minutes
    • RoHS Compliant
    • UV Blocking and AOI Fluorescence
     High throughput and accuracy during PCB
    fabrication and assembly
    • Superior Processing
     Closest to conventional FR-4 processing
    • Core Material Standard Availability
     Thickness: 0.002″ (0.05 mm) to 0.125″
    (3.2 mm)
     Available in full size sheet or panel form
    • Prepreg Standard Availability
     Roll or panel form
     Tooling of prepreg panels available
    • Copper Foil Type Availability
     Standard HTE Grade 3
     RTF (Reverse Treat Foil)
    • Copper Weights
     ½, 1 and 2 oz (18, 35 and 70 μm) available
     Heavier copper available upon request
     Thinner copper foil available upon request
    • Glass Fabric Availability
     Standard E-glass
     Square weave glass fabric available
     Spread glass fabric available
    • Industry Approvals
     IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
     UL - File Number E41625 as PCL-FR-370HR
     Qualified to UL's MCIL Program


    Rogers material in stock:


    BrandModelThickness(mm)DK(ER)
    F4BF4B0.382.2
    F4B0.552.23
    F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
    F4Bk0.8,1.52.65
    F4B0.83.5
    FE=F4BM12.2
    RogersRO40030.254 0.508,0.813,1.5243.38
    RO43500.254 0.508,0.762,1.5243.5
    RO58800.254.0.508.0.7622.2
    RO30030.127,0.508,0.762,1.5243
    RO30100.63510.2
    RO32060.635MM10.2
    R030350.508MM3.5
    RO60100.635MM, 1,27MM10.2

    Quality 2oz Black Sloder Immersion Gold High TG PCB Board Electronic Prototype for sale
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