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High Thermal Conductivity FR4 PCB 10 Layer 3 Mil Rapid Prototyping Circuit

Shenzhen Xinchenger Electronic Co.,Ltd

High Thermal Conductivity FR4 PCB 10 Layer 3 Mil Rapid Prototyping Circuit

High Thermal Conductivity FR4 PCB 10 Layer 3 Mil Rapid Prototyping Circuit

High Thermal Conductivity FR4 PCB 10 Layer 3 Mil Line Space And Width Specification: Model:XCEF Board size:5*6cm Board Thickness:1.2MM Profile:V-Cut Layer:10 Test:flying probe for sample. test jig ...

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pcb manufacturing process

      

Custom Printed Circuit Board

      
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